Samsung developed an 8-chip technology with a thickness of just 0.6mm

Samsung developed an 8-chip technology with a thickness of just 0.6mm, the world's thicknes multi-die package according to the company.

Multichip refers to the product that piles up single semiconductors to increase memory capacity and this is the first time to implement less than 1mm in thickness.

The new technology was applied to 32GB nand flash multi chip. The new 0.6mm-thick package, which consists of eight identical dies, uses 30nm-class, 32Gb NAND Flash chips, each measuring just 15?m, to deliver a 32GB NAND solution.

Existing nand flash multi chip package implemented only 1mm by processing wafer to 60?m. If process the thickness of wafer to below 30?m, it will be hard to maintain strength of chip and secure yield rate because gap between multi chips will become too narrow.

Samsung succeeded in overcoming technical limit to process wafer to 15?m. By securing processing technology, it will be able to pile more chips to increase capacity. This means that consumers can see thinner SSD and memory cards, for example.

Samsung claims that the 8 layer multichip with 0.6mm is the most suitable solution in mobile devices market. The new packaging technology is claimed to deliver a 40% thinner and lighter memory solutions for high-density multimedia handsets and other mobile devices.

In addition, the package technology can be adapted to other existing MCPs, configured as system in packages (SiP), or package on packages (PoP).